Redmi is preparing to launch a new device with a MediaTek Dimensity 7000 chipset. The chipset was not unveiled by MediaTek. However, it looks like the new Redmi phone will be the first. The new chipset will sit under the recently launched MediaTek Dimensity 9000 chip, which is built using 4nm architecture.
Redmi’s general manager Lou Weibing shared a teaser for the device. The teaser is not available in detail and it even reveals the name of the new smartphone. An earlier report suggested that a Redmi K50 series device would use the latest Dimensity 7000 SoC. However, there is no confirmation on the same subject.
A recent leak from the digital chat station claims that the Redmi K50 will have the new Dimension 9000 SoC. If the leak turns out to be true, then the upcoming device with Dimensity 7000 SoC will be a brand new smartphone. There is also a possibility that Redmi will launch one version of Redmi K50 with Dimension 9000 and another with Dimension 7000.
The Redmi K50 series is expected to have a 108MP primary camera, a 5000mAh battery and an under-screen fingerprint sensor.
Redmi is also expected to launch a new K40S smartphone. The device is expected to be powered by Snapdragon 870 chipset or MediaTek Dimensity 1200 SoC. In the case of camera systems, the device can get either a 50-megapixel or a 64-megapixel primary sensor.
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