Qualcomm today introduced a new 5G modem dubbed as the Snapdragon X75 5G. The newly introduced Snapdragon X75 5G is the successor to the Snapdragon X70 5G modem that was launched last year, and is a part of the company’s sixth-generation modem-to-antenna solution. Qualcomm says the Snapdragon X75 5G will power a range of devices, including smartphones, personal computers, mobile broadband, automobiles, satellite communications, industrial IoT, fixed wireless access, and 5G private networks.
Qualcomm says that the Snapdragon X75 5G modem is currently being sampled, and commercial devices powered by this modem are expected to launch by the second half of 2023.
Qualcomm Snapdragon X75 5G: Features
Talking about the features, Qualcomm says that the Snapdragon X75 5G is ready to support 5G Advance, which is the next step in 5G. It is the first modem-RF system with a dedicated hardware tensor accelerator, i.e. Qualcomm 5G AI Processor Gen 2 which delivers up to 2.5X better AI performance compared to Gen 1 modem i.e. Snapdragon X70 5G. It introduces several new technologies such as the Qualcomm 5G AI Suite Gen 2 which includes new AI-powered optimizations to achieve better speed, coverage, mobility, link strength and location accuracy. The Qualcomm 5G AI Suite offers advanced AI-based capabilities including sensor-assisted mmWave beam management and AI-enhanced GNSS location Gen 2.
Other key technologies included in the Snapdragon X75 5G are – 10-carrier aggregation for mmWave for greater spectrum aggregation and capacity, 5x downlink carrier aggregation and FDD uplink MIMO for the sub-6 GHz band; Added a convergence transceiver for mmWave and Sub-6 with the new Qualcomm QTM565 fifth generation mmWave antenna module to produce lower cost, board complexity, hardware footprint and power consumption; Qualcomm Advanced Modem-RF software suite, which the company says continuously improves performance across user scenarios including elevators, subway trains, airports, parking garages, mobile gaming sessions, and more; AI-based sensor-assisted mmWave beam management for improved connectivity reliability and AI-based location accuracy enhancements; Qualcomm 5G PowerSave Gen 4 and Qualcomm RF Power Efficiency Suite for extended battery life; Qualcomm DSDA Gen 2 supports enabling 5G/4G dual data on two SIM cards simultaneously; Qualcomm Smart Transmit Gen 4, which Qualcomm says will enable fast, reliable and long-distance uploads; and support for Snapdragon Satellite.
Qualcomm Fixed Wireless Access Platform Gen 3
Qualcomm also announced the Qualcomm Fixed Wireless Access Platform Gen 3, which Qualcomm says is a fully integrated 5G advance-ready Fixed Wireless Access (FWA) with mmWave, sub-6 GHz and Wi-Fi 7 support. ) platform, which also includes 10 Gb Ethernet capability.
Key features of the Qualcomm Fixed Wireless Access Platform Gen 3 include – a converged mmWave-Sub-6 hardware architecture aimed to reduce footprint, cost, board complexity and power consumption; Qualcomm Dynamic Antenna Steering Gen 2 for improved self-install capabilities; Qualcomm RF Sensing Suite to enable indoor mmWave CPE deployments; Qualcomm Tri-Band Wi-Fi 7, supporting up to 320 MHz channels with expert multi-link operation for fast, low latency, reliable connections and mesh capability for seamless coverage; flexible software architecture; And the dual SIM Gen 3 platform has support for both 5G dual-SIM dual active (DSDA) and dual-SIM dual standby (DSDS) configurations.
“Qualcomm FWA Gen 3 will help enable a wide range of applications and value-added services for mobile operators and help them drive rural, suburban and dense urban communities to wirelessly access fiber-like internet over 5G Will provide an effective way to speed up. Drive FWA adoption globally and take another step towards closing the digital divide,” Qualcomm wrote in a blog post.
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